ECD M.O.L.E.® Thermal Profiling - White Paper

What is J-Standard compliance and why should you care? Is your operation in full compliance? Is your team adopting practices that may be sacrificing compliance? What’s your confidence level that moisture sensitive components have been stored correctly? With the abundance of misleading information, outdated practices, and simple lack of understanding, you may be at risk of unintentionally producing suspect assemblies.

Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.

The demands of moisture sensitive devices (MSDs) and the standards that govern their handling have generated additional manufacturing processes and procedures. In some cases, these processes and procedures are no longer needed because the standards have changed, are conservative in application or even misinterpreted. Regardless of these realities, some processes, like baking, have become entrenched – a permanent fixture that may waste precious time, energy and money.

Much has been written on the subject of electrostatic discharge (ESD) and moisture and their destructive impact on sensitive electronic devices. With today’s ever-increasing densities and shrinking package sizes, damage is caused by even lower potentials and less moisture than ever before. It’s time to take a renewed look at the issues and consider better ways to monitor and document the environment in the electronics manufacturing industry.